主要職責(zé)

1. create HW module specification per customer and system requirements;

根據(jù)客戶和系統(tǒng)需求，創(chuàng)建硬件模塊技術(shù)說明書

2. develop hardware architecture with existing development standards and design guidelines;

根據(jù)開發(fā)流程和設(shè)計規(guī)范指南，創(chuàng)建硬件架構(gòu)

3. Analyze, simulate and optimize electronic circuit according to existing HW architecture;

依據(jù)硬件架構(gòu)，對模塊電路進(jìn)行仿真，分析，優(yōu)化

4.Define material and components with consideration of economic,

qualitative and technological aspects in a project group;

對器件從質(zhì)量，經(jīng)濟(jì)，技術(shù)等角度考慮進(jìn)行優(yōu)選

5. Create HW related documents per hardware development process (like BOM, circuit diagram, WCA, FMEA)

依據(jù)硬件開發(fā)流程，創(chuàng)建硬件相關(guān)文檔如BOM, WCA,FMEA…

6. Perform defined hardware development reviews through the full hardware development

process and release documents;

進(jìn)行硬件開發(fā)相關(guān)的活動如原理圖評審，文檔的創(chuàng)建與發(fā)放

7.Hardware verification plan based on the system requirement,

and organize the verification test of circuit function, performance and Vehicle test.

編寫硬件測試規(guī)格書，并依據(jù)規(guī)格書對功能進(jìn)行測試驗證，同時支持整車試驗及功能驗證

8. Analyze and solve the hardware issues occurred during DV（include EMC）, PV and Vehicle test, and record all the issues in the lesson learned

解決DV/PV/EMC試驗中遇到的硬件問題,并做好經(jīng)驗總結(jié)

9.Support project quotation with leading by Program manager and technical communication

supporting to acquisition team leading by sales.

在項目經(jīng)理領(lǐng)導(dǎo)下支持項目報價，以及在銷售領(lǐng)導(dǎo)下支持項目的技術(shù)交流。

10. Other job assigned by superior.

上級主管安排的其它工作。

能力要求

1.Good understanding and sloid experienced with hardware development process

also be familiar with HW module testing standards (automotive level related)

熟練掌握硬件開發(fā)的流程，以及熟悉汽車行業(yè)硬件模塊開發(fā)的測試標(biāo)準(zhǔn).

2. Strong background & knowledge on electronic engineering, automotive is plus.

具有很強(qiáng)的電子開發(fā)的背景和知識，汽車行業(yè)優(yōu)先。

3. Master to use HW development tools (such as Cadence, MathCAD, ICAPS, oscillograph，etc…)

掌握使用基本的硬件開發(fā)工具（比如Cadence, MathCAD, ICAPS, oscillograph 等）

4. Business English language required

商務(wù)英語溝通無障礙

5. At least 2 years working experience in electronics development, automotive experience is preferred.

至少2年以上電子開發(fā)設(shè)計經(jīng)驗，汽車行業(yè)優(yōu)先。

6. Above engineering bachelor’s degree required, electronics/software relative is preferred.

工程背景本科學(xué)士以上，電子或者軟件相關(guān)背景優(yōu)先。

7. Good communication skill, team working sprit and strong proactive working attitude with target orientation.

較強(qiáng)的溝通能力，強(qiáng)烈的團(tuán)隊合作精神以及以目標(biāo)為導(dǎo)向的積極工作態(tài)度。

8. Strong continual learning skills

長期學(xué)習(xí)提高的能力

9. 熟悉質(zhì)量五大工具 APQP, PPAP, MSA, SPC, FMEA、接受過IATF16949方面的培訓(xùn)。