職責(zé)描述:
1.負(fù)責(zé)電鍍設(shè)備開發(fā)和迭代;
Responsible for ECP tool development and iterative optimization;
2.與機(jī)械、電氣、軟件等設(shè)計部門合作,提供設(shè)計建議和設(shè)備標(biāo)準(zhǔn);
Responsible for co-working with mechanical, electrical, software design department, to provide design suggestion and tool standard;
3.負(fù)責(zé)設(shè)備硬件和軟件測試標(biāo)準(zhǔn)(Check Sheet),安裝調(diào)試流程(SOP),維護(hù)保養(yǎng)(PM)標(biāo)準(zhǔn)文件制定和撰寫;
Responsible for tool hardware and software test check sheet, installation operating procedure (SOP), preventive maintenance (PM) formulate and write;
4.負(fù)責(zé)售后服務(wù)工程師培訓(xùn);
Responsible for tool service engineer training;
5.作為產(chǎn)品組技術(shù)專家牽頭解決設(shè)備技術(shù)問題;
As the production team expert lead to solve tool hardware technical issue。
任職要求:
1.5年以上晶圓廠(Fab)電鍍設(shè)備工程師,或設(shè)備商售后服務(wù)工作經(jīng)驗;
Over 5years working experience as Fab plating hardware engineer or tool vendor service engineer
2.掌握半導(dǎo)體電鍍設(shè)備硬件構(gòu)造,原理和系統(tǒng)架構(gòu)為佳;
Master in semiconductor plating tool Structure, mechanism and system architecture is preferred;
3.熟悉電鍍工藝原理;
Familiar with plating process mechanism;
4.有電氣和機(jī)械相關(guān)基礎(chǔ)知識;
Expert in electrical and mechanical relevant basic knowledge;
5.有設(shè)備技術(shù)標(biāo)準(zhǔn)文件制定經(jīng)驗優(yōu)先;
Experience in tool technical standard formulate and write is preferred;
6.本科以上理工科相關(guān)專業(yè);
Bachelor degree and above, major in engineering;
7.擅長溝通并能適應(yīng)一定程度加班;
Good at communication and for overtime work to complete tasks on time。